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Socket / Footprint / IC Package Types w/ Dimensions

PGA - Pin Grid Array

QFP - Quad Flat Pack.See: Footprint

PLCC - Plastic Leaded Chip Carrier. See: Footprint

DIP - Dual Inline Package. See: Footprint

PDIP - Plastic Dual Inline Package. See: Footprint

CDIP - Ceramic Dual Inline Package

SDIP - Skinny DIP (300 mil body) See: Footprint

SOIC - Small Outline IC. See: Footprint

BGA - Ball Grid Array.

SOJ - Small Outline. See: Footprint

WSOJ -  400mil Small Outline. See: Footprint

SOP - Small Outline. See: Footprint

SSOP - Shrink Small Outline. See: Footprint

TSOP. Thin Small Outline Package. See: Footprint

STSOP. Small TSOP See: Footprint

See also:


file: /Techref/sockets.htm, 3KB, , updated: 2021/4/5 10:35, local time: 2024/7/18 04:40,

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