PGA - Pin Grid Array
QFP - Quad Flat Pack.See: Footprint
PLCC - Plastic Leaded Chip Carrier. See: Footprint
DIP - Dual Inline Package. See: Footprint
PDIP - Plastic Dual Inline Package. See: Footprint
CDIP - Ceramic Dual Inline Package
SDIP - Skinny DIP (300 mil body) See: Footprint
SOIC - Small Outline IC. See: Footprint
BGA - Ball Grid Array.
SOJ - Small Outline. See: Footprint
WSOJ - 400mil Small Outline. See: Footprint
SOP - Small Outline. See: Footprint
SSOP - Shrink Small Outline. See: Footprint
TSOP. Thin Small Outline Package. See: Footprint
STSOP. Small TSOP See: Footprint
|file: /Techref/sockets.htm, 3KB, , updated: 2021/4/5 10:35, local time: 2023/6/3 13:47,
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<A HREF="http://www.massmind.org/techref/sockets.htm"> Socket / Footprint / IC Package Types</A>
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